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The ability to measure and characterize high-aspect-ratio devices has become critical in the development of complex semiconductor memory structures.
In this webinar, we explore how the Thermo Scientific Helios 5 PXL Wafer DualBeam provides deep structural insights to high-aspect-ratio memory devices with its plasma FIB milling capabilities and high-resolution SEM imaging.
Learn how an automated in-fab workflow can provide rapid access to critical data and significantly accelerate development and yield learning processes.