Analyzing semiconductor memory devices

Welcome to our dedicated resource webpage for the latest insights and information on metrology, defect analysis, and failure analysis solutions for memory technology. Our webpage offers a wide range of valuable resources, including on-demand webinars, leader interviews, documents, and blogs. Whether you're an experienced professional or new to the field, our webpage is the perfect place to access up-to-date information and stay informed on the latest trends and technologies. Our resources are designed to help you navigate the complex world of metrology and defect analysis easily, with in-depth technical discussions and practical tips. Take some time to explore our webpage and discover the valuable resources we have to offer.


Semiconductor industry leader interviews

Helios 6 HD FIB-SEM

In this interview, Michael Rauscher talks about how the Helios 6 HD FIB-SEM meets the trends in electron microscopy and the importance of repeatability when dealing with large volumes of TEM data.


Semiconductor memory device analysis documents

Helios 5 PXL Wafer DualBeam: 3D Metrology of Advanced 3D NAND Architectures

 

Learn more about the applications of focused ion beam milling in the metrology of 3D NAND and other advanced memory devices.


For Research Use Only. Not for use in diagnostic procedures.